SMD assembly
Our Electronics Assembly Hub is the center for assembly and connection technology: SMD automatic assembly, manual assembly according to IPC as well as tests and inspections.
Welcome to the center for cutting-edge SMD assembly solutions. In the world of electronics manufacturing, advances in SMD technology continue to push the boundaries of what is possible. With reliability, efficiency and precision in every aspect of electronic component assembly, we offer customized SMD assembly solutions tailored to the specific needs of our customers.
Our SMD assembly capabilities are in line with our commitment to excellence and technological leadership. With state-of-the-art manufacturing equipment and a team of experts, we are well equipped to meet the growing demands in various industries - from medical technology to industrial applications.
Contact our application experts
Automatic component placement
Our automated placement lines enable fast, precise and controlled placement processes. The SMD (surface-mounted device) components are placed in the previously applied solder paste by machine. In the subsequent reflow soldering process, the mechanical fixation and electrical contacting takes place. We work together with renowned machine manufacturers who stand for continuous further development of the processes (e.g. Yamaha, SMT, Göpel, MyData, Uniclean, Kolb). Our procedures and processes are constantly being optimized.
- Precise and variable dispensing with Jet Printer
- Fast, precise and controlled placement processes
- Reflow soldering processes with variable soldering programs; possible variation of parameters: Oxygen content / nitrogen content / with and without vacuum, time and temperature, etc.
- Inspection of all circuits using 2D and 3D AOI technology
- X-ray inspection / CT scan for non-destructive material testing, localization; volume analysis
SMD automatic assembly
We manufacture series and quantities from 1 from samples and prototypes to small and large series. Various soldering techniques are used. In addition to SMT (surface-mounting technology) surface mounting, we also offer SMD assembly with adhesive. Depending on requirements, we use various solder pastes, including lead-free ones. Our sales team will be happy to advise you on individual options.
- Reflow soldering / full convection reflow soldering (reflow soldering),
- Vapor phase soldering/condensation soldering (vapor phase soldering)
- Vacuum soldering SMT
Facts and figures
| Smallest component that can be set by machine: | 01005 Zoll |
|---|---|
| Other components: | SOIC, SOT, SOD, TSOP, MELF, CSP, QFP, BGA etc. |
| Assembly performance: | bis zu 90.000 BE pro Stunde |
| Assembly time: | beidseitig bestücktes Board mit 825 BE (0201 bis FBGA484) in 265 Sekunden |
| Optical 3D inspection of height and position in the µm range | |
| Prototypes and sample production | |
| Small, medium and large series |
Bauteil-Reinigung
Ein wichtiger Prozessschritt zur Qualitätssicherung ist die Reinigung von Bauteilen und Schaltungsträgern während oder nach der Bestückung. Unser automatisierter Reinigungsprozess erfolgt über Mehrkammern-Reinigungssystem. Variable Reinigungsprogramme (Variation der Parameter: Zeit, Temperatur, mit und ohne Ultraschallreinigung) ermöglichen optimale Ergebnisse.
- Anwendung eines Kontaminometer (Überprüfung der Partikelbelastung und Verschmutzungsgrad)
- Feinwäsche für empfindliche und sensible Bauteile und Leiterplatten mittels Neukum und ISO – Wäsche
- Zusammenarbeit und Beratung durch weltweit führenden Anbieter für Präzisionsreinigung in der Elektronikfertigung, der Zestron GmbH
Measuring and testing technology - Process control
The functionality is tested and ensured by our trained and qualified specialist staff and our engineers in the field of measurement technology. We are able to respond to customer requirements. Together with our team, we can design suitable test adapters and check their functionality using software.
- General data acquisition, storage and analysis options for selected parameters
- Determination of measured variables such as R (resistance [Ω]), L (inductance [H]), C (capacitance), (DC voltage), (DC current), (AC voltage), (AC current) or time signals
- Execution of function test (FCT), in-circuit test (ICT), sensor test, boundary scan, high-voltage test and memory programming
- Automated test sequences
We will be happy to advise you on your development project and the optimum substrate and packaging technologies.
Direct contact to contact persons
Elektronische Mikro Systeme
