Thickfilm technology - customized hybrid circuits
Highest efficiency for customized hybrid modules through in-house design and production of thick-film circuits.
Expertise and experience in the development and production of miniaturized electronic modules in thick-film hybrid technology - We offer our customers complete solutions of the highest quality through a 360° service from development and layout to substrate production and packaging. Also for small and medium quantities.
Contact our application experts
Expertise in the development and production of thickfilm substrates made in Germany
The production of durable hybrid circuits requires know-how and experience. Conventional and special electronic components such as resistors, conductor tracks, contact systems and multi-level wiring carriers are applied in the tightest of spaces using modern screen printing machines. This creates complex components with optimum specifications.
In order to achieve a particularly precise resistance value, we use active and passive laser alignment. Glazes and protective coatings to protect the circuits can also be applied using the screen printing process.
Typical structure of a ceramic hybrid circuit
Thick-film technology is used in electronics production to manufacture multilayer PCBs and hybrid circuits. Hybrid technology offers enormous flexibility in the design of circuits. The conductor tracks are applied directly to ceramic, aluminum or glass substrates by screen printing. After drying and sintering a layer, this process can be repeated several times. All resistors, including coils and capacitors if necessary, are also printed on. They are then trimmed to the desired value using a laser.
Precision through laser trimming to adjust resistors
During laser trimming, the resistances of circuits and integrated circuits are trimmed to the exact resistance value (passive adjustment) or to the function of the circuit (active adjustment). Technological tolerances are adjusted to the ideal resistance values. The resistors thus have excellent properties with high performance and dielectric strength. During the trimming process, the respective output signal is constantly measured and compared with the setpoint value. When the target value is reached, the laser cut stops automatically.
Technical details
The values given here are standard values. We advise our customers on the development of application-specific solutions through to complete packaging solutions for electronic modules and complex circuits on ceramic substrates:
| Substrates | Aluminium oxide (Al2O3) |
|---|---|
| Standard size | 4" × 4" |
| Standard substrate thicknesses | Standard Substrat Dicken: 0,254 / 0,381 / 0,635 / 0,762 / 1,02 / 1,52 / 2,03 mm |
| Paste systems | AgPd, AgPt, Au, resistance pastes, dielectrics, overglaze |
| Construction | Monolayer, multilayer (typical: 4) duplex print, Metallisierte Durchgangslöcher, Durchkontaktierungen, Zwischenschichtanschluss |
| Resistors | Thick film pastes, trimmable, also PTC for Sensoranwendungen |
We will be happy to advise you on your development project and the optimum substrate and packaging technologies.
Direct contact to contact persons
Elektronische Mikro Systeme
