Solder assembly
All manual processes in electronics production are carried out by our qualified and certified specialist personnel. In-house IPC training and courses ensure consistently high process quality.
We are a strong partner for aerospace, medical technology, sensor technology, measurement and machine technology and other industries. Our team is made up of a mix of experienced and young specialists, consisting of master craftsmen, specialists, engineers and technicians. With know-how and experience, we realize ideas and concepts and implement customer wishes and complex requests.
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Soldering technologies and processes
For many component sizes, special components and components that cannot be assembled by machine, we use piston soldering processes for joining. Hybrids are manufactured and joined using LP (by means of selective / piston soldering). We carry out comb assembly / surface mounting of SIL leadframes and DIL leadframes with a pitch of 1.27 mm to 2.54 mm.
- Piston soldering process for many component sizes, special components and components that cannot be set by machine
- Manufacture of hybrids and their connection with LP (using selective / piston soldering processes)
- Comb assembly / surface mounting of SIL leadframes (single in-line) and DIL leadframes (dual in-line) with 1.27 mm to 2.54 mm pitch
- Dip soldering of leaded and lead-free connections
- Crimping and assembly of cable connections
- Degold plating and pre-tinning of components
- Surface treatment using pyrolysis processes
- Production and processing of various types of adhesive (silicone-containing and silicone-free, etc.) and realization of bubble-free adhesive joints
Qualifications and certifications of our production
Our own IPC trainers permanently train our employees. All hand soldering processes comply with IPC-A-610. The classification and visual inspection of LP is carried out in accordance with IPC-A-610 for the respective product classes.
- Production in accordance with ESA standards (AeroSpace), compliance with ECSS-Q-ST-70-08, ECSS-Q-ST-70-38, ECSS-Q-ST-10-09, ECSS-Q-ST-70-26 and ECSS-Q-ST-70-30
- THT (through-hole technology) through-hole mounting
- Certified personnel according to J-STD-001 (hand soldering and visual inspection according to J-STD-001), HL 3 (production with highly reliable hand soldering processes according to ESA specification), HL 4 (inspector according to ESA specification), HL 5 (repair of assemblies according to ESA specification), SMT 4 (production of highly reliable solder connections in SMT according to ESA specification), LFV (crimping, wire wrap according to ESA specification)
We will be happy to advise you on your development project and the optimum substrate and packaging technologies.
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Elektronische Mikro Systeme
