Circuit protection
In order to protect electronic components from external influences, we offer various coating processes.
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Coating process
- Paint passivation using the immersion process
- Passivation with Hysol
- Passivation and encapsulation with silicone-containing materials in a silicone chamber
- The following processes are also used: Masking, unmasking, housing, encapsulation, dip coating, potting, etc.
- Materials used include: Pastes, lacquers and two-component silicones, Hysol etc.
- Parylene
Hermetic housing
- Metal-glass / ceramic-metal / ceramic-ceramic closure
- Bake-out and emptying for vacuum applications
- Inert gas filling
- Various welding and soldering processes: Laser and resistance welding, vacuum and filler gas brazing
Parylene coating
Parylene coating can significantly improve the functional reliability of electronic components. It is often the ideal solution for protecting high-quality components. The coating is deposited on the substrate in a vacuum by resublimation from the gas phase as a non-porous and transparent polymer film.
The commonly used term parylene or parylene is the abbreviation for the chemically correct term poly-para-xylylene. Parylene is characterized by an extraordinarily high resistance to almost all aggressive media and solvents. The water permeability is extremely low, even with minimal layer thickness. In addition, the plastic's resistance to ageing is very high.
Completely conformal coating - In contrast to coatings applied in liquid form, Parylene also reaches areas of the component from the gas phase that remain inaccessible to liquids.
A coating with Parylene can be considered if:
- Electronic components must meet the highest safety and durability requirements,
- Components are exposed to extreme environmental conditions,
- Aggressive media must not cause any damage,
- Must not oxidize metals,
- Good sliding properties and low abrasion are important,
- Highest performance and certifications according to US MIl and US NBC are required,
- Safety-relevant applications according to UL (Underwriters Laboratories) are realized,
- Parylene continues to be approved by FDA and USP (United States Pharmacopeia) Class VI.
Parylene types
Parylene N | Very good gap mobility and maximum coating penetration Optimum dielectric properties and dielectric strength Temperature stability up to 90 °C |
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Parylene C | Very good barrier effect High moisture protection due to hydrophobic properties High elasticity, therefore suitable for plastic and elastomer coatings High film thickness growth (up to 10 µm/h) Temperature stability up to 125 °C |
Parylene D | Highly hydrophobic properties High temperature stability up to 180 °C Used to protect electronic components in the aerospace industry. |
Parylene F | Highest temperature resistance up to 350 °C |
We will be happy to advise you on your development project and the optimum substrate and packaging technologies.